At the heart of Intel’s new mobile
PC (personal computer) MCM is the combination of its EMIB (embedded multi-die interconnect bridge) technology with a new power-sharing framework. Intel’s MCM mounts its H-Core processors, AMD’s GPU, and HMB2 (high-bandwidth memory) on a small enclosed circuit board and interconnects these three chips through its EMIB, a dedicated highway that transmits data between the three components.
As EMIB supports high-speed communication between different architecture mounted on a single chip, it enables heterogeneous architecture. This ensures the delivery of high performance without increasing the height of the system. AMD’s GPU would be the first product to use EMIB technology.
